SIP design

Insight SiP proposes a turn-key design service for highly integrated system solutions in the System-in-Package (SiP) arena. The service is based on a unique design methodology that ensures close to first pass design success.

Key Benefits

  • Fast time to market
  • Lowest cost and size for each SiP project
  • Address multiple technologies: LTCC, Laminate, Thin film on Silicon (IPD - sbSiP)
  • Production ready designs
  • Close relationships with key manufacturing partners
  • Design flow optimized for co-design with semiconductor companies

Capabilities

Insight SiP offers an end to end design service for SiP:

  • Feasibility studies
  • Detailed design process
  • IP Library of Basic Embedded RF functions: Baluns, Capacitors, Inductors, Filters
  • Pre-selection and certification of sub-contractors

Design example

SIP manufacturing

Feasibility Studies

In order to optimize an RF SiP for a particular application in terms of size, cost and performance it is crucial to consider and compare all the technology choices that are available.

Insight SiP has design experience and manufacturing partnerships for each of the 3 major integration technologies:

  • Multi-layer laminate substrates using FR4, BT, Gtek material sets in mechanical and laser drilled HDI options.
  • Multi-layer Low Temperature Co-fired Ceramic (LTCC) substrates.
  • Thin film on silicon for Integrated Passive Devices.

At this stage it is also important to consider the optimum semiconductor technologies for each part of the SiP and to correctly partition the system between the substrate, semiconductor dice and the passive SMT devices. Co-working with semiconductor suppliers and end customers is a key to success.

Design of Buried Functions within the substrate

Insight SiP has developed a flexible design methodology to obtain first pass design success for buried functions (filters, baluns, matching and interconnections). This methodology, using standard EDA packages, has a proven track record.

Insight SiP has significant data-base of IP designs for buried functions that speeds the design process.

System design and integration

The final stage of the design process is to integrate the individual functional blocks of the SiP within the complete SiP design. This process involves dense multi-layer routing with severe mechanical and electrical constraints. Insight SiP has many years experience in radio system design (GSM, 3G, Bluetooth, WLAN, low power ISM, RFID,..).

The prototype phase uses the production manufacturing partners to optimize production ramp up.

The prototype evaluation and debug phase is kept under control thanks to extensive simulation during the design phase.

Headquarters

Insight SiP SAS
Agora Einstein
905 rue Albert Einstein
BP 60247
06905 Sophia-Antipolis Cedex
France

UK Offices

Sophicam Ltd
Salisbury House - Station Road
Cambridge CB1 2LA
United Kingdom

Contacts

Tel +33 4 9290 7330
Fax +33 4 9290 7331
Email contact@insightsip.com